Weicon Easy-Mix N 5000 epoxy adhesive

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Cechy szczególne: Klej/uszczelniacz dwuskładnikowy, Wysoka przyczepność i adhezja

Pojemność opakowania: 50g

Przemysł: Energetyczny, Motoryzacja, Obróbka i produkcja metali, Papier i Celuloza, Przemysł ciężki, Transport

Weicon Easy-Mix N 5000 epoxy adhesive

Fast, colorless / transparent / liquid / self-leveling / shorter open time
WEICON Easy-Mix N 5000 is a transparent, liquid, self-leveling adhesive with high adhesive strength. Easy-Mix N 5000 can be used on many materials, such as metal, plastic, composite fiber, ceramic, glass, stone or wood.

The Easy-Mix D 50 dispensing gun is required to process Easy-Mix products in 50 ml containers.

Application:

  • For low energy plastics
  • For composite materials
  • For glass
  • For ceramics
  • For wood
  • For composite fibers
  • To the stone
  • Shelf life 18 months at +20°C in a dry, dark place
  • Shelf life 6 months if these storage instructions are not followed

Features and Benefits:

  • Resistant to temperatures up to +100°C
  • High adhesive strength
  • Transparent color
  • Two-component glue
  • High adhesion strength
  • Liquid self-leveling adhesive
  • short opening time

Technical data (data source TDS_10650850 pdf)

Base Epoxy resin, unfilled
Properties Liquid
Color almost colorless, crystal clear
Resin/hardener mixing ratio capacity (automatic) 1:1
Viscosity of the mixture 1.07 g/cm³
Mixture viscosity at +20 °C (+68 °F) 5,000 mPa s
Maximum gap up to 2mm
Application temperature +10 to +35 °C
Curing temperature +6 to +40 °C
Open time at +20°C portion 10 m 20 min
Strength 35% after 60 min
Transfer of mechanical load (50% strength) after 3 hrs
Final strength (100%) after 48 hrs
Average resin strength DIN EN 1465
Pressure 10 Mpa
Adhesion 40 Mpa
Bending 50 Mpa
Tg room temperature 52.4°C
Tg at 120°C 54.2 °C
E-Module 1.700 - 2.000 Mpa
Shore D hardness 65
Average shear strength DIN EN 1465
sandblasted steel 21 N/mm²
Sandblasted aluminum 19 N/mm²
Hard PVC rough 14 N/mm²
Linear shrinkage 2.0%
Thermal resistance -50 to +100°C
Thermal resistance (23 °C) 0.121 mm²/s
Thermal conductivity 0.14 W/m K
Thermal Specification 1.531 J/(g K)
Characteristic properties 1.59 10^12 ohm
Product number:
10046416
EAN
4024596069872

Application method:

The conditions for perfect bonding are clean and dry surfaces (cleaning and degreasing with WEICON Surface Cleaner). Smooth surfaces should be machined. WEICON Easy-Mix products can be applied directly from the double cartridge using a static mixer. Discard the first 5 cm of the adhesive. The adhesive is applied from one side. The open times given refer to a 10 ml mixture at room temperature. Larger quantities will cure faster due to the thermal reaction typical of epoxy resins. Higher temperatures shorten the curing time and the open time of the adhesive processing. (as a guide - each 10°C above room temperature shortens both times by 50%). At temperatures below +16°C the open time and the curing time are extended. From a temperature of approx. +5°C no further reaction occurs.

Safety and health

When using WEICON products, please observe the physical, safety, toxicological and ecological data and regulations in our safety data sheets (www.weicon.de)

Available packaging and accessories:

[ 50g ] [ Easy-Mix D 50 Dosing Gun ] [ Nozzle ] [ Dosing tips ]

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